Top Preface Program Poster Session Organizing Committee Photos Past Symposia The 20th RIES-HOKUDAI International Symposium
Invited Speakers J. Fraser Stoddart(Northwestern University) Chihaya Adachi(Kyushu University) Takuzo Aida(The University of Tokyo) Henry Dube(Ludwig-Maximilians-Universität) Shigeru Kitazawa (Osaka University) Hiroshi Kori(The University of Tokyo) Alexander S. Mikhailov( Fritz Haber Institute /Kanazawa University) Hiroaki Misawa(Hokkaido University) Takayoshi Nakamura (Hokkaido University) Mikako Ogawa(Hokkaido University) Tsuyoshi Sekitani(Osaka University) Keisuke Takahashi(Hokkaido University) Barry A. Trimmer(Tufts University) Christoph Weder(University of Fribourg)
Date December 2 –3, 2019 Organized by Research Institute for Electronic Science (RIES), Hokkaido University Registration JavaScript is required on this page. Please enable JavaScript. Deadline: Participants with poster presentations: October 15 Participants without poster presentation: November 15 Abstract submission Abstract submission for poster presentation Deadline: October 18 Venue Hokkaido University Conference Hall Contact (E-mail) Symposium poster Joint with the 4th International Symposium of Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials(Five-Star Alliance) Five-Star Alliance Sponsors