Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics

Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
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Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics

Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
Event date
Main Event: 26 – 27 November 2025
Satellite Event: 2025 RIES-CEFMS Joint International Symposium This event is held at a different venue. 28 November 2025
Venue
Main Event: Hotel Monterey Edelhof Sapporo（12F, Japan）
Satellite Event: [Tentative] Hokkaido University, North Campus Area, Creative Research Institution (CRIS) Building, 5F Large Conference Room
Fee
Free
Contact
riessympo2025□es.hokudai.ac.jp Please change □ to @.
Organized by
Registration
Deadline poster presentation: Month Day, 2025
Participation only: Month Day, 2025
Registration
Abstract submission
Deadline October 31, 2025
Abstract Submission
Program
GeneralNow available. Final updates underway. PostersOpening in November.
Poster A2 size
symposium poster
PDF (1MB)
Poster Awards
  • P00 Name [BEST poster]
  • P00 Name
  • P00 Name
  • P00 Name
  • P00 Name
Congratulations!!

Keynote Speakers

Speaker Name
Ying-Hao Chu
National Tsing Hua Univ., Taiwan
Speaker Name
Yoshihiro Iwasa
RIKEN

Invited Speakers

Speaker Name
Ray-Hua Horng
NYCU, Taiwan
Speaker Name
Emila Panda
IITGN, India
Speaker Name
Hajime Nakanotani
RIES, Hokkaido Univ.
Speaker Name
Yu-Jung Lu
Academia Sinica, Taiwan
Speaker Name
Manisha Samanta
IITGN, India
Speaker Name
Saneyuki Ohno
IMRAM, Tohoku Univ.
Speaker Name
Atsushi Shishido
CLS, Science Tokyo
Speaker Name
Yuki Yamada
SANKEN, Osaka Univ.
Speaker Name
Masaki Horie
RIES, Hokkaido Univ.
Speaker Name
Shiyoshi Yokoyama
IMCE, Kyushu Univ.