Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics

Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
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Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics

Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
Event date
Main Event: 26 – 27 November 2025
Satellite Event: 2025 RIES-CEFMS Joint International Symposium This event is held at a different venue. 28 November 2025
Venue
Main Event: Hotel Monterey Edelhof Sapporo（12F, Japan）
Satellite Event: [Tentative] Hokkaido University, North Campus Area, Creative Research Institution (CRIS) Building, 5F Large Conference Room
Fee
Free
Contact
riessympo2025□es.hokudai.ac.jp Please change □ to @.
Organized by
Registration
Deadline poster presentation: October 31, 2025
Participation only: November 8, 2025
Registration
Abstract submission
Deadline October 31, 2025
Abstract Submission
Program
GeneralNow available. Final updates underway. PostersNow available.
Poster A2 size
symposium poster
PDF (1MB)

Keynote Speakers

Ying-Hao Chu
Ying-Hao Chu
National Tsing Hua Univ., Taiwan
Yoshihiro Iwasa
Yoshihiro Iwasa
RIKEN

Invited Speakers

Ray-Hua Horng
Ray-Hua Horng
NYCU, Taiwan
Emila Panda
Emila Panda
IITGN, India
Hajime Nakanotani
Hajime Nakanotani
RIES, Hokkaido Univ.
Yu-Jung Lu
Yu-Jung Lu
Academia Sinica, Taiwan
Manisha Samanta
Manisha Samanta
IITGN, India
Saneyuki Ohno
Saneyuki Ohno
IMRAM, Tohoku Univ.
Atsushi Shishido
Atsushi Shishido
CLS, Science Tokyo
Yuki Yamada
Yuki Yamada
SANKEN, Osaka Univ.
Masaki Horie
Masaki Horie
RIES, Hokkaido Univ.
Shiyoshi Yokoyama
Shiyoshi Yokoyama
IMCE, Kyushu Univ.