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Preface
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Presentation / Participation
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Program
Program; Poster
Abstract
Organizing Committee
Link to 2025 RIES-CEFMS
Past Symposia
Link to RIES
Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics
Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
Japan–Taiwan–India Symposium on Materials & Information Science for Future Electronics
Jointed with the 26th RIES–HOKUDAI International Symposium "共"[kyou] & 5+2 Joint Symposium
Instructions
For Oral Presenters
For Poster Presenters
Preparation of the poster:A0 size [84.1 cm x 118.9 cm]
Download
Abstract Format (A4 size, 1page)